RH821-1E3 vs 1N821A136 feature comparison

RH821-1E3 Microsemi Corporation

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1N821A136 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP NXP SEMICONDUCTORS
Package Description O-LALF-W2 O-LALF-W2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature RADIATION HARDENED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-7 DO-34
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W 0.4 W
Reference Voltage-Nom 6.2 V 6.2 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 0.62 mV/°C 0.62 mV/°C
Voltage Tol-Max 5%
Base Number Matches 1 1
Operating Temperature-Max 200 °C
Qualification Status Not Qualified
Working Test Current 7.5 mA

Compare RH821-1E3 with alternatives

Compare 1N821A136 with alternatives