RGP10DT50A
vs
JANS1N5614
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
SEMTECH CORP
|
Part Package Code |
DO-41
|
|
Package Description |
D4, 2 PIN
|
HERMETIC SEALED PACKAGE-2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-41
|
|
JESD-30 Code |
O-PALF-W2
|
O-XALF-W2
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
200 °C
|
Operating Temperature-Min |
-65 °C
|
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
3 W
|
|
Qualification Status |
Not Qualified
|
Qualified
|
Rep Pk Reverse Voltage-Max |
200 V
|
200 V
|
Reverse Recovery Time-Max |
0.15 µs
|
2 µs
|
Surface Mount |
NO
|
NO
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
1
|
1
|
Forward Voltage-Max (VF) |
|
1.2 V
|
Non-rep Pk Forward Current-Max |
|
50 A
|
Reference Standard |
|
MIL-19500
|
|
|
|
Compare RGP10DT50A with alternatives
Compare JANS1N5614 with alternatives