RGC2010DTD267K vs BCTS002010-2673DTE feature comparison

RGC2010DTD267K SEI Stackpole Electronics Inc

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BCTS002010-2673DTE Chilisin Electronics Corp

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer STACKPOLE ELECTRONICS INC CHILISIN ELECTRONICS CORP
Package Description SMT, 2010 CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature SEMI PRECISION ANTI-SULFUR
Construction Rectangular Rectangular
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, EMBOSSED PLASTIC, 7 INCH Tape
Rated Power Dissipation (P) 0.75 W 0.75 W
Rated Temperature 70 °C 70 °C
Resistance 267000 Ω 267000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1

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