RFP70N06
vs
SSP4N55
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
TO-220
|
SFM
|
| Package Description |
TO-220AB, 3 PIN
|
FLANGE MOUNT, R-PSFM-T3
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
TO-220, MOLDED, 3LEAD, JEDEC VARIATION AB
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
8541.29.00.95
|
| Case Connection |
DRAIN
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
| DS Breakdown Voltage-Min |
60 V
|
550 V
|
| Drain Current-Max (ID) |
70 A
|
4 A
|
| Drain-source On Resistance-Max |
0.014 Ω
|
2.5 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JEDEC-95 Code |
TO-220AB
|
TO-220AB
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| JESD-609 Code |
e3
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
150 W
|
75 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
5
|
1
|
| Avalanche Energy Rating (Eas) |
|
358 mJ
|
| Feedback Cap-Max (Crss) |
|
40 pF
|
| Power Dissipation Ambient-Max |
|
75 W
|
| Pulsed Drain Current-Max (IDM) |
|
16 A
|
| Turn-off Time-Max (toff) |
|
160 ns
|
| Turn-on Time-Max (ton) |
|
190 ns
|
|
|
|
Compare RFP70N06 with alternatives
Compare SSP4N55 with alternatives