RFD20N03SM vs BUK9230-100B,118 feature comparison

RFD20N03SM Fairchild Semiconductor Corporation

Buy Now Datasheet

BUK9230-100B,118 NXP Semiconductors

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
Additional Feature MEGAFET LOGIC LEVEL COMPITABLE
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 30 V 100 V
Drain Current-Max (ID) 20 A 47 A
Drain-source On Resistance-Max 0.025 Ω 0.03 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-252AA TO-252AA
JESD-30 Code R-PSSO-G2 R-PSSO-G2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 175 °C 185 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 90 W 167 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 4 2
Part Package Code DPAK
Package Description PLASTIC, SC-63, DPAK-3
Pin Count 3
Manufacturer Package Code SOT428
HTS Code 8541.29.00.75
Avalanche Energy Rating (Eas) 150 mJ
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Pulsed Drain Current-Max (IDM) 185 A
Time@Peak Reflow Temperature-Max (s) 30

Compare RFD20N03SM with alternatives

Compare BUK9230-100B,118 with alternatives