RF2374TR7
vs
BGA2012,115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
RF MICRO DEVICES INC
|
NXP SEMICONDUCTORS
|
| Package Description |
LCC8,.08SQ,25
|
TSSOP6,.08
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
5A991.G
|
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Characteristic Impedance |
50 Ω
|
50 Ω
|
| Construction |
COMPONENT
|
COMPONENT
|
| Gain |
9 dB
|
14 dB
|
| Input Power-Max (CW) |
10 dBm
|
|
| JESD-609 Code |
e3
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
6
|
| Operating Frequency-Max |
3800 MHz
|
|
| Operating Frequency-Min |
800 MHz
|
|
| Operating Temperature-Max |
85 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
LCC8,.08SQ,25
|
TSSOP6,.08
|
| Power Supplies |
3 V
|
3 V
|
| RF/Microwave Device Type |
WIDE BAND LOW POWER
|
NARROW BAND LOW POWER
|
| Surface Mount |
YES
|
YES
|
| Technology |
GAAS
|
BIPOLAR
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin (Sn)
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
6
|
| Manufacturer Package Code |
|
SOT363
|
| Supply Current-Max |
|
10 mA
|
|
|
|
Compare RF2374TR7 with alternatives
Compare BGA2012,115 with alternatives