RD74LVC1G126WPE
vs
NC7ST04M5X
feature comparison
Part Life Cycle Code |
Not Recommended
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
|
Package Description |
VFBGA,
|
THERMALLY ENHANCED, PLASTIC, SOT-23, 5 PIN
|
Pin Count |
5
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Family |
LVC/LCX/Z
|
HST/T
|
JESD-30 Code |
R-PBGA-B5
|
R-PDSO-G5
|
Length |
1.1 mm
|
2.9 mm
|
Logic IC Type |
BUFFER
|
INVERTER
|
Number of Functions |
1
|
1
|
Number of Inputs |
1
|
1
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
8 ns
|
31 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.4 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.4 mm
|
0.95 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
0.7 mm
|
1.6 mm
|
Base Number Matches |
1
|
5
|
Package Equivalence Code |
|
TSOP5/6,.11,37
|
|
|
|
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