RD48F2000P0XBQ0
vs
S29WS064J0PBFW00
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NUMONYX
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
TFBGA, BGA88,8X12,32
Pin Count
88/80
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
85 ns
55 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block
BOTTOM
BOTTOM/TOP
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
NO
YES
JESD-30 Code
R-PBGA-B80
R-PBGA-B80
Length
10 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
Moisture Sensitivity Level
1
Number of Functions
1
Number of Sectors/Size
4,63
16,126
Number of Terminals
80
80
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA88,8X12,32
BGA80,8X10,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Page Size
4 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Sector Size
16K,64K
4K,32K
Standby Current-Max
0.000135 A
0.00005 A
Supply Current-Max
0.028 mA
0.054 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
YES
Type
NOR TYPE
NOR TYPE
Width
8 mm
Base Number Matches
3
3
Power Supplies
1.8 V
Ready/Busy
YES
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