RCS1608F7323CS
vs
MCR03ERTF7323
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
SAMSUNG ELECTRO-MECHANICS
ROHM CO LTD
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
Factory Lead Time
24 Weeks
Additional Feature
ANTI-SULFUR
Construction
Rectangular
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.45 mm
Package Length
1.6 mm
1.6 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
0.8 mm
0.8 mm
Packing Method
TR, CARDBOARD PAPER, 7 INCH
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.1 W
0.1 W
Rated Temperature
70 °C
70 °C
Resistance
732000 Ω
732000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
TIN OVER NICKEL
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
50 V
50 V
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8533.21.00.30
Reference Standard
TS 16949
Compare RCS1608F7323CS with alternatives
Compare MCR03ERTF7323 with alternatives