RCS1608F3091CS
vs
HCHP0603100PPM3.09K1%WE4
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SAMSUNG ELECTRO-MECHANICS
|
VISHAY INTERTECHNOLOGY INC
|
Package Description |
CHIP
|
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
24 Weeks
|
|
Additional Feature |
ANTI-SULFUR
|
|
Construction |
Rectangular
|
Chip
|
JESD-609 Code |
e3
|
e4
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
155 °C
|
155 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.45 mm
|
0.5 mm
|
Package Length |
1.6 mm
|
1.52 mm
|
Package Shape |
RECTANGULAR PACKAGE
|
|
Package Style |
SMT
|
SMT
|
Package Width |
0.8 mm
|
0.85 mm
|
Packing Method |
TR, CARDBOARD PAPER, 7 INCH
|
Waffle Pack
|
Rated Power Dissipation (P) |
0.1 W
|
0.125 W
|
Rated Temperature |
70 °C
|
|
Resistance |
3090 Ω
|
3090 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
0603
|
0603
|
Surface Mount |
YES
|
YES
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Terminal Finish |
TIN OVER NICKEL
|
Gold (Au) - with Nickel (Ni) barrier
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Tolerance |
1%
|
1%
|
Working Voltage |
50 V
|
50 V
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
Reference Standard |
|
MIL-R-55342D
|
|
|
|
Compare RCS1608F3091CS with alternatives
Compare HCHP0603100PPM3.09K1%WE4 with alternatives