RC48F4400P0VB0EA
vs
K8F1315EBM-DC1C0
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NUMONYX
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA-64
9 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-64
Pin Count
64
64
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
ASYNCHRONOUS READ MODE
SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE
Alternate Memory Width
16
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
11 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32MX16
32MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1 mm
Supply Voltage-Max (Vsup)
2 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
10 mm
9 mm
Base Number Matches
2
1
Rohs Code
Access Time-Max
110 ns
JESD-609 Code
e1
Moisture Sensitivity Level
2
Supply Voltage-Nom (Vsup)
1.8 V
Terminal Finish
TIN SILVER COPPER
Compare RC48F4400P0VB0EA with alternatives
Compare K8F1315EBM-DC1C0 with alternatives