RC3225F3010GS
vs
CR1210F3010T1LF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
SAMSUNG ELECTRO-MECHANICS
CHIP TECHNOLOGIES INC
Package Description
CHIP, ROHS COMPLIANT
CHIP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8533.21.00.30
Additional Feature
PRECISION
Construction
Chip
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Height
0.55 mm
Package Length
3.2 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
Package Width
2.55 mm
Packing Method
BULK
Rated Power Dissipation (P)
0.33 W
Rated Temperature
70 °C
Resistance
301 Ω
Resistor Type
FIXED RESISTOR
Size Code
1210
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
1%
Working Voltage
200 V
Base Number Matches
1
2
Compare RC3225F3010GS with alternatives
Compare CR1210F3010T1LF with alternatives