RC28F128P30TF65 vs PC28F128P30TF65 feature comparison

RC28F128P30TF65 Micron Technology Inc

Buy Now Datasheet

PC28F128P30TF65 Micron Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 10 X 13 MM, 1.20 MM HEIGHT, BGA-64 TBGA,
Pin Count 64 64
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 65 ns 65 ns
Additional Feature TOP BOOT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP BOOT; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block TOP TOP
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e0 e1
Length 13 mm 13 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 235
Programming Voltage 1.8 V 1.8 V
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 2 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD SILVER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 10 mm 10 mm
Base Number Matches 1 1

Compare RC28F128P30TF65 with alternatives

Compare PC28F128P30TF65 with alternatives