RC28F128J3D-75 vs RC28F128J3F75B feature comparison

RC28F128J3D-75 Micron Technology Inc

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RC28F128J3F75B Micron Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 75 ns 75 ns
Alternate Memory Width 8 8
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling NO NO
JESD-30 Code S-PBGA-B64 R-PBGA-B64
JESD-609 Code e0 e0
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Sectors/Size 128 128
Number of Terminals 64 64
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TBGA
Package Equivalence Code BGA64,8X8,40 BGA64,8X8,40
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE
Page Size 4/8 words 4/8 words
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Sector Size 128K 128K
Standby Current-Max 0.00012 A 0.00012 A
Supply Current-Max 0.054 mA 0.08 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit NO NO
Type NOR TYPE NOR TYPE
Base Number Matches 3 1
Pbfree Code No
Part Package Code BGA
Package Description BGA-64
Pin Count 64
Length 13 mm
Number of Functions 1
Operating Mode ASYNCHRONOUS
Peak Reflow Temperature (Cel) 235
Programming Voltage 2.7 V
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm

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