RC2010F3321-07-RG70
vs
201007F3321T3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TAITRON COMPONENTS INC
ROYAL ELECTRONIC FTY CO LTD
Package Description
CHIP
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Additional Feature
LASER TRIMMABLE
Construction
Rectangular
Chip
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
5 mm
5 mm
Package Style
SMT
SMT
Package Width
2.5 mm
2.5 mm
Packing Method
TR, EMBOSSED PLASTIC, 7 INCH
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
70 °C
Resistance
3320 Ω
3320 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Series
2010(3/4WS,F TOL)
Compare RC2010F3321-07-RG70 with alternatives
Compare 201007F3321T3 with alternatives