RC1608F681GS vs RM06FBN6800 feature comparison

RC1608F681GS Samsung Electro-Mechanics

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RM06FBN6800 TA-I Technology Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG ELECTRO-MECHANICS TA-I TECHNOLOGY CO LTD
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e3 e3
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method Bulk Bulk
Rated Power Dissipation (P) 0.1 W 0.1 W
Resistance 680 Ω 680 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Series RM(STANDARD)

Compare RC1608F681GS with alternatives

Compare RM06FBN6800 with alternatives