RC1608F681GS
vs
RM06FBN6800
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG ELECTRO-MECHANICS
TA-I TECHNOLOGY CO LTD
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e3
e3
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.45 mm
Package Length
1.6 mm
1.6 mm
Package Style
SMT
SMT
Package Width
0.8 mm
0.8 mm
Packing Method
Bulk
Bulk
Rated Power Dissipation (P)
0.1 W
0.1 W
Resistance
680 Ω
680 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Tolerance
1%
1%
Working Voltage
50 V
50 V
Base Number Matches
1
1
Series
RM(STANDARD)
Compare RC1608F681GS with alternatives
Compare RM06FBN6800 with alternatives