RC12L3R01FBL vs TSR1GF3R01V feature comparison

RC12L3R01FBL Fenghua (HK) Electronics Ltd

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TSR1GF3R01V Tateyama Kagaku Group

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction RECTANGULAR PACKAGE Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 6.4 mm 6.3 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 3.2 mm 3.2 mm
Packing Method Bulk Tape
Rated Power Dissipation (P) 1 W 1 W
Rated Temperature 70 °C
Resistance 3.01 Ω 3.01 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2512 2512
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 250 ppm/°C 250 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1

Compare RC12L3R01FBL with alternatives

Compare TSR1GF3R01V with alternatives