RAVF102D335%R
vs
TSN2EJ330
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STACKPOLE ELECTRONICS INC
|
TATEYAMA KAGAKU GROUP
|
| Package Description |
CHIP, ROHS COMPLIANT
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.20
|
|
| Element Power Dissipation |
0.063 W
|
|
| First Element Resistance |
33 Ω
|
|
| JESD-609 Code |
e3
|
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Network Type |
ISOLATED
|
ISOLATED
|
| Number of Elements |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
155 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
RECTANGULAR PACKAGE
|
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
TR
|
Bulk
|
| Rated Power Dissipation (P) |
0.125 W
|
0.063 W
|
| Rated Temperature |
70 °C
|
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Size Code |
0404
|
0404
|
| Surface Mount |
YES
|
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
|
| Terminal Shape |
WRAPAROUND
|
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
25 V
|
25 V
|
| Base Number Matches |
1
|
1
|
| Construction |
|
Chip
|
| Package Height |
|
0.35 mm
|
| Package Length |
|
1 mm
|
| Package Width |
|
1 mm
|
| Resistance |
|
33 Ω
|
|
|
|
Compare RAVF102D335%R with alternatives
Compare TSN2EJ330 with alternatives