RAG06K823JBG vs HP06W2J0823TEE feature comparison

RAG06K823JBG Fenghua (HK) Electronics Ltd

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HP06W2J0823TEE Royal Electronic Factory (Thailand) Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.2 mm 3.1 mm
Package Style SMT SMT
Package Width 1.6 mm 1.55 mm
Packing Method BULK TR
Rated Power Dissipation (P) 0.5 W 0.5 W
Rated Temperature 70 °C
Reference Standard IEC61340-3-1
Resistance 82000 Ω 82000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
JESD-609 Code e3
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier

Compare RAG06K823JBG with alternatives

Compare HP06W2J0823TEE with alternatives