RACF648RJT3K30
vs
RAC648R3.3K5%R
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STACKPOLE ELECTRONICS INC
STACKPOLE ELECTRONICS INC
Package Description
CHIP, ROHS COMPLIANT
CHIP
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
Construction
Rectangular
Chip
Element Power Dissipation
0.063 W
0.063 W
First Element Resistance
3300 Ω
3300 Ω
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
8
Number of Functions
1
1
Number of Terminals
10
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
3.1 mm
6.4 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
6.4 mm
3.1 mm
Packing Method
TR, PLASTIC
TAPE, EMBOSSED
Rated Temperature
70 °C
70 °C
Resistance
3300 Ω
3300 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
3300 Ω
Size Code
1225
1225
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
50 V
50 V
Base Number Matches
1
1
HTS Code
8533.21.00.20
Manufacturer Series
RAC
Rated Power Dissipation (P)
0.063 W
Series
RAC648R(5%)
Compare RACF648RJT3K30 with alternatives
Compare RAC648R3.3K5%R with alternatives