RACF648R8.2K5%R
vs
CND2B10TBK822J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STACKPOLE ELECTRONICS INC
KOA SPEER ELECTRONICS INC
Package Description
CHIP, ROHS COMPLIANT
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.20
Construction
Chip
Chip
Element Power Dissipation
0.063 W
First Element Resistance
8200 Ω
JESD-609 Code
e3
e3
Manufacturer Series
RAC
Mounting Feature
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
Number of Functions
1
Number of Terminals
10
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
6.4 mm
6.4 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
3.1 mm
3.1 mm
Packing Method
TAPE, EMBOSSED
Bulk
Rated Power Dissipation (P)
0.063 W
0.063 W
Rated Temperature
70 °C
Resistance
8200 Ω
8200 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Series
RAC648R(5%)
Size Code
1225
2512
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
50 V
50 V
Base Number Matches
2
1
Compare RACF648R8.2K5%R with alternatives
Compare CND2B10TBK822J with alternatives