RAC408M27K5%R
vs
RACF408M27K5%R
feature comparison
All Stats
Differences Only
Pbfree Code
No
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STACKPOLE ELECTRONICS INC
STACKPOLE ELECTRONICS INC
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.20
8533.21.00.20
Construction
Chip
Chip
Element Power Dissipation
0.063 W
0.063 W
First Element Resistance
27000 Ω
27000 Ω
Manufacturer Series
RAC
RAC
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
8
Number of Functions
1
1
Number of Terminals
10
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
4 mm
4 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.1 mm
2.1 mm
Packing Method
TAPE, EMBOSSED
TAPE, EMBOSSED
Rated Power Dissipation (P)
0.063 W
0.063 W
Rated Temperature
70 °C
70 °C
Resistance
27000 Ω
27000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Series
RAC408M(5%)
RAC408M(5%)
Size Code
0816
0816
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
1
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Compare RAC408M27K5%R with alternatives
Compare RACF408M27K5%R with alternatives