RAA207705GBM#HC0
vs
LT8620MPMSE#TRPBF
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
LINEAR TECHNOLOGY CORP
|
Part Package Code |
S-WFBGA
|
MSOP
|
Package Description |
VFBGA, BGA20,4X5,26/20
|
LEAD FREE, PLASTIC, MSOP-16
|
Pin Count |
20
|
16
|
Manufacturer Package Code |
SWBG0020ZA
|
MSE
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A002
|
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Additional Feature |
VOUT RANGE=(0.8-5 VOLT)
|
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
VOLTAGE-MODE
|
CURRENT-MODE
|
Input Voltage-Max |
16 V
|
65 V
|
Input Voltage-Min |
3 V
|
3.4 V
|
Input Voltage-Nom |
12 V
|
4 V
|
JESD-30 Code |
R-PBGA-B20
|
R-PDSO-G16
|
Length |
2.67 mm
|
4.039 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
125 °C
|
150 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Current-Max |
5 A
|
2 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HTSSOP
|
Package Equivalence Code |
BGA20,4X5,26/20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.715 mm
|
1.1 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
2000 kHz
|
2200 kHz
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
2.37 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Control Technique |
|
PULSE WIDTH MODULATION
|
JESD-609 Code |
|
e3
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare RAA207705GBM#HC0 with alternatives