R5F51115ADFK#3A
vs
R5F51115ADFK#30
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
LQFP
|
LQFP
|
| Package Description |
LQFP-64
|
LQFP,
|
| Pin Count |
64
|
64
|
| Manufacturer Package Code |
PLQP0064GA
|
PLQP0064GA
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 8 MHZ AT 1.8V MIN SUPPLY, 3V IS MIN SUPPLY WHEN USB USED
|
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
YES
|
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G64
|
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of I/O Lines |
48
|
48
|
| Number of Terminals |
64
|
64
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LQFP
|
LQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| RAM (bytes) |
16384
|
|
| ROM (words) |
131072
|
131072
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1.7 mm
|
|
| Speed |
32 MHz
|
32 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
1.8 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.31.00.01
|
|
|
|
Compare R5F51115ADFK#3A with alternatives
Compare R5F51115ADFK#30 with alternatives