R5F364AMDFB
vs
R5F364AENFB#30
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFP
|
LQFP
|
| Package Description |
14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100
|
QFP, QFP100,.63SQ,20
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
20
|
20
|
| Bit Size |
16
|
16
|
| CPU Family |
M16C
|
M16C
|
| Clock Frequency-Max |
20 MHz
|
|
| DAC Channels |
YES
|
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| Length |
14 mm
|
14 mm
|
| Number of I/O Lines |
88
|
85
|
| Number of Terminals |
100
|
100
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
QFP
|
| Package Equivalence Code |
QFP100,.63SQ,20
|
QFP100,.63SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
31744
|
20480
|
| ROM (words) |
524288
|
262144
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.7 mm
|
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
5 V
|
2.7 V
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
PLQP0100KB
|
| Factory Lead Time |
|
12 Weeks
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare R5F364AMDFB with alternatives
Compare R5F364AENFB#30 with alternatives