R5F364AENFB#30
vs
R5F364A6NFB#V2
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
LQFP
|
LQFP
|
Package Description |
QFP, QFP100,.63SQ,20
|
|
Pin Count |
100
|
100
|
Manufacturer Package Code |
PLQP0100KB
|
PLQP0100KB
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
12 Weeks
|
|
Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
Has ADC |
YES
|
|
Address Bus Width |
20
|
|
Bit Size |
16
|
|
CPU Family |
M16C
|
|
DMA Channels |
YES
|
|
External Data Bus Width |
16
|
|
JESD-30 Code |
S-PQFP-G100
|
|
JESD-609 Code |
e3
|
|
Length |
14 mm
|
|
Moisture Sensitivity Level |
1
|
3
|
Number of I/O Lines |
85
|
|
Number of Terminals |
100
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-20 °C
|
|
PWM Channels |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
QFP
|
|
Package Equivalence Code |
QFP100,.63SQ,20
|
|
Package Shape |
SQUARE
|
|
Package Style |
FLATPACK
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
RAM (bytes) |
20480
|
|
ROM (words) |
262144
|
|
ROM Programmability |
FLASH
|
|
Speed |
25 MHz
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
2.7 V
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
14 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8542.31.00.01
|
Technology |
|
CMOS
|
|
|
|
Compare R5F364AENFB#30 with alternatives
Compare R5F364A6NFB#V2 with alternatives