R5F364A6DFB#V2
vs
R5F364A6DFB#U0
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
LQFP
|
QFP
|
Pin Count |
100
|
100
|
Manufacturer Package Code |
PLQP0100KB
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Moisture Sensitivity Level |
3
|
1
|
Technology |
CMOS
|
CMOS
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
Bit Size |
|
16
|
CPU Family |
|
M16C
|
JESD-30 Code |
|
S-PQFP-G100
|
JESD-609 Code |
|
e3
|
Number of Terminals |
|
100
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
QFP
|
Package Equivalence Code |
|
QFP100,.63SQ,20
|
Package Shape |
|
SQUARE
|
Package Style |
|
FLATPACK
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
12288
|
ROM (words) |
|
131072
|
ROM Programmability |
|
FLASH
|
Speed |
|
25 MHz
|
Surface Mount |
|
YES
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
|
|
|
Compare R5F364A6DFB#V2 with alternatives
Compare R5F364A6DFB#U0 with alternatives