R5F2M132BDFP#V0
vs
R5F2M132BDFP#X4
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
LQFP
|
LQFP
|
| Pin Count |
32
|
32
|
| Manufacturer Package Code |
PLQP0032GB
|
PLQP0032GB
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Bit Size |
16
|
16
|
| CPU Family |
R8C
|
R8C
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
QFP32,.35SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
512
|
512
|
| ROM (words) |
8192
|
8192
|
| ROM Programmability |
FLASH
|
FLASH
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Current-Max |
7.5 mA
|
7.5 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare R5F2M132BDFP#V0 with alternatives
Compare R5F2M132BDFP#X4 with alternatives