R5F100FGAFP#30
vs
R5F100FGAFP#V0
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
LQFP
|
LQFP
|
Package Description |
,
|
|
Pin Count |
44
|
44
|
Manufacturer Package Code |
PLQP0044GC
|
PLQP0044GC
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
12 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
Moisture Sensitivity Level |
3
|
3
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, CISC
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Has ADC |
|
YES
|
Additional Feature |
|
IT ALSO OPERATES AT 4MHZ @1.6V MIN SUPPLY @ LOW-VOLTAGE MAIN MODE
|
Address Bus Width |
|
|
Bit Size |
|
16
|
Boundary Scan |
|
NO
|
Clock Frequency-Max |
|
20 MHz
|
DAC Channels |
|
NO
|
DMA Channels |
|
YES
|
External Data Bus Width |
|
|
JESD-30 Code |
|
S-PQFP-G44
|
Length |
|
10 mm
|
Number of I/O Lines |
|
40
|
Number of Terminals |
|
44
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
|
YES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LQFP
|
Package Shape |
|
SQUARE
|
Package Style |
|
FLATPACK, LOW PROFILE
|
RAM (bytes) |
|
12288
|
ROM (words) |
|
131072
|
ROM Programmability |
|
FLASH
|
Seated Height-Max |
|
1.6 mm
|
Speed |
|
32 MHz
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
3 V
|
Supply Voltage-Nom |
|
3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
QUAD
|
Width |
|
10 mm
|
|
|
|