R1RW0416DSB-2PI
vs
K6R4016V1B-TI12
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
TSOP2
Package Description
SOP, TSOP44,.46,32
TSOP2, TSOP44,.46,32
Pin Count
44
44
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
12 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
Length
18.41 mm
18.41 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
2
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX16
256KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSOP2
Package Equivalence Code
TSOP44,.46,32
TSOP44,.46,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.005 A
0.01 A
Standby Voltage-Min
3 V
3 V
Supply Current-Max
0.13 mA
0.245 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare R1RW0416DSB-2PI with alternatives
Compare K6R4016V1B-TI12 with alternatives