R1LV1616HBG-5SI#B0 vs K6F1616U6M-EF55 feature comparison

R1LV1616HBG-5SI#B0 Renesas Electronics Corporation

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K6F1616U6M-EF55 Samsung Semiconductor

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code FBGA(48) BGA
Package Description BGA, VFBGA,
Pin Count 48 48
Manufacturer Package Code PTBG0048HF
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 52 Weeks
Samacsys Manufacturer Renesas Electronics
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Length 12 mm
Seated Height-Max 1 mm
Terminal Pitch 0.75 mm
Width 9 mm

Compare R1LV1616HBG-5SI#B0 with alternatives

Compare K6F1616U6M-EF55 with alternatives