R1LV0408DSB-7LI
vs
WMS512K8-L45CLC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MICROSEMI CORP
Part Package Code
TSOP2
QFJ
Package Description
SOP, TSOP32,.46
QCCN,
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
70 ns
45 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G32
R-CQCC-N32
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX8
512KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
QCCN
Package Equivalence Code
TSOP32,.46
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
2 V
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
QUAD
Base Number Matches
1
1
JESD-609 Code
e4
Peak Reflow Temperature (Cel)
225
Terminal Finish
GOLD
Time@Peak Reflow Temperature-Max (s)
30
Compare R1LV0408DSB-7LI with alternatives
Compare WMS512K8-L45CLC with alternatives