QU80386EXTC33 vs 5962M8957801XX feature comparison

QU80386EXTC33 Intel Corporation

Buy Now Datasheet

5962M8957801XX Cobham Semiconductor Solutions

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP AEROFLEX COLORADO SPRINGS
Package Description TQFP-144 PGA,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Intel
Address Bus Width 26 16
Bit Size 32 16
Boundary Scan YES NO
Clock Frequency-Max 25 MHz 12 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G132 S-CPGA-P144
Length 24.13 mm 39.751 mm
Low Power Mode YES YES
Number of DMA Channels 2
Number of External Interrupts 12
Number of Serial I/Os 3
Number of Terminals 132 144
Operating Temperature-Max 117 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code BQFP PGA
Package Equivalence Code SPQFP132,1.1SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, BUMPER GRID ARRAY
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 4.57 mm 4.826 mm
Speed 33 MHz 12 MHz
Supply Current-Max 320 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Form GULL WING PIN/PEG
Terminal Pitch 0.635 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Width 24.13 mm 39.751 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code PGA
Pin Count 144
ECCN Code 3A001.A.2.C
Screening Level MIL-STD-883
Temperature Grade MILITARY
Total Dose 3k Rad(Si) V

Compare QU80386EXTC33 with alternatives

Compare 5962M8957801XX with alternatives