QS74LCX16500CPA
vs
74LCX16500CW
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Package Description |
TSSOP, TSSOP56,.3,20
|
DIE,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
INDEPENDENT CONTROL
|
|
| Count Direction |
BIDIRECTIONAL
|
|
| JESD-30 Code |
R-PDSO-G56
|
X-XUUC-N56
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Max I(ol) |
0.024 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
56
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
DIE
|
| Package Equivalence Code |
TSSOP56,.3,20
|
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Prop. Delay@Nom-Sup |
4.6 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Trigger Type |
NEGATIVE EDGE
|
|
| Base Number Matches |
2
|
1
|
| Family |
|
LVC/LCX/Z
|
| Propagation Delay (tpd) |
|
8.4 ns
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
|
|
|
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