QS74FCT827BTP
vs
PI74FCT827ATP
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
PERICOM SEMICONDUCTOR CORP
|
Package Description |
DIP-24
|
DIP, DIP24,.3
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Control Type |
ENABLE LOW
|
ENABLE LOW
|
JESD-30 Code |
R-PDIP-T24
|
R-PDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Max I(ol) |
0.048 A
|
0.048 A
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Prop. Delay@Nom-Sup |
5 ns
|
6.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
DIP
|
Pin Count |
|
24
|
ECCN Code |
|
EAR99
|
Additional Feature |
|
WITH DUAL OUTPUT ENABLE
|
Family |
|
FCT
|
Length |
|
31.85 mm
|
Number of Ports |
|
2
|
Propagation Delay (tpd) |
|
15 ns
|
Seated Height-Max |
|
4.19 mm
|
Supply Voltage-Max (Vsup) |
|
5.25 V
|
Supply Voltage-Min (Vsup) |
|
4.75 V
|
Width |
|
7.62 mm
|
|
|
|
Compare QS74FCT827BTP with alternatives
Compare PI74FCT827ATP with alternatives