QS74FCT257ATP
vs
54F251/B2C
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
DIP-16
|
QCCN, LCC20,.35SQ
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| Family |
FCT
|
|
| JESD-30 Code |
R-PDIP-T16
|
S-XQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.048 A
|
0.02 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
8
|
| Number of Outputs |
1
|
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP16,.3
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Prop. Delay@Nom-Sup |
5 ns
|
12.5 ns
|
| Propagation Delay (tpd) |
5 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Power Supply Current-Max (ICC) |
|
26 mA
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare QS74FCT257ATP with alternatives