QS74FCT157ATDB vs IDT74FCT157DTP feature comparison

QS74FCT157ATDB Quality Semiconductor Inc

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IDT74FCT157DTP Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer QUALITY SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown not_compliant
kg CO2e/kg 12.6
Average Weight (mg) 1187.4
CO2e (mg) 14961.241
Category CO2 Kg 12.6
Compliance Temperature Grade Industrial: -40C to +85C
Family FCT FCT
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 7 ns 3.9 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 16
HTS Code 8542.39.00.01
JESD-609 Code e0
Length 19.1135 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.048 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 3.9 ns
Seated Height-Max 4.191 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 7.62 mm

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