QS54FCT253CTH
vs
N74F158AN,602
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
QUALITY SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Package Description
,
DIP, DIP16,.3
Reach Compliance Code
unknown
compliant
Family
FCT
F/FAST
JESD-30 Code
R-CDSO-G20
R-PDIP-T16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
4
Number of Inputs
4
2
Number of Outputs
1
1
Number of Terminals
20
16
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
INVERTED
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
JESD-609 Code
e4
Length
19.025 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.02 A
Package Equivalence Code
DIP16,.3
Power Supply Current-Max (ICC)
19 mA
Prop. Delay@Nom-Sup
7 ns
Propagation Delay (tpd)
7 ns
Seated Height-Max
4.2 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare QS54FCT253CTH with alternatives
Compare N74F158AN,602 with alternatives