QS34X245Q3G
vs
FST34X245QSP
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
QVSOP
|
SSOP
|
Pin Count |
80
|
80
|
Manufacturer Package Code |
DMG80
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
Renesas Electronics
|
|
Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
JESD-30 Code |
R-PDSO-G80
|
R-PDSO-G80
|
JESD-609 Code |
e3
|
|
Length |
20.4978 mm
|
20.5 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
Number of Bits |
8
|
8
|
Number of Functions |
4
|
4
|
Number of Ports |
2
|
2
|
Number of Terminals |
80
|
80
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Equivalence Code |
SSOP80,.25,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Packing Method |
TUBE
|
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.7526 mm
|
2 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
NOT SPECIFIED
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9116 mm
|
3.9 mm
|
Base Number Matches |
4
|
1
|
Package Description |
|
SSOP,
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare QS34X245Q3G with alternatives
Compare FST34X245QSP with alternatives