QS3383Q vs 74LVX3L383QSC feature comparison

QS3383Q Integrated Device Technology Inc

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74LVX3L383QSC National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description QSOP-24 SSOP, SSOP24,.24
Pin Count 24
Reach Compliance Code not_compliant unknown
Additional Feature TTL COMPATIBLE BUS SWITCH TTL COMPATIBLE BUS SWITCH
Family 3383 LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e0 e0
Length 8.6614 mm 8.65 mm
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Moisture Sensitivity Level 1
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 4 4
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP24,.24 SSOP24,.24
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7272 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9116 mm 3.9116 mm
Base Number Matches 8 1
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF

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Compare 74LVX3L383QSC with alternatives