QS316212PA vs IDT74FST163212PA feature comparison

QS316212PA Integrated Device Technology Inc

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IDT74FST163212PA Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description TSSOP, TSSOP56,.3,20 TSSOP, TSSOP56,.3,20
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 316212 CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e0 e0
Length 14 mm 14 mm
Logic IC Type BUS EXCHANGER BUS EXCHANGER
Moisture Sensitivity Level 1 1
Number of Bits 2 2
Number of Functions 12 12
Number of Ports 4 4
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP56,.3,20 TSSOP56,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 240
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 20
Width 6.1 mm 6.1 mm
Base Number Matches 2 1
Part Package Code TSSOP
Pin Count 56
Additional Feature TTL COMPATIBLE BUS SWITCH
Load Capacitance (CL) 50 pF

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