QP7C291A-25WMB
vs
AM27C291-25DC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, CERAMIC, DIP3-24
DIP, DIP24(UNSPEC)
Pin Count
24
24
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Memory Density
16384 bit
16384 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Organization
2KX8
2KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Supply Current-Max
0.09 mA
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
No
Rohs Code
No
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
DIP24(UNSPEC)
Terminal Finish
TIN LEAD
Compare QP7C291A-25WMB with alternatives
Compare AM27C291-25DC with alternatives