PZ5032NS7BC-S vs PZ5032NS7BC feature comparison

PZ5032NS7BC-S Philips Semiconductors

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PZ5032NS7BC AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS XILINX INC
Package Description QFP, TQFP44,.47SQ,32 QFP, TQFP44,.47SQ,32
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
In-System Programmable YES YES
JESD-30 Code S-PQFP-G44 S-PQFP-G44
JESD-609 Code e0
JTAG BST YES YES
Number of Macro Cells 32 32
Number of Terminals 44 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code TQFP44,.47SQ,32 TQFP44,.47SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Packing Method TRAY
Programmable Logic Type EE PLD EE PLD
Propagation Delay 9.5 ns 9.5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Base Number Matches 3 3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30