PZ5032I10A44
vs
PZ5032NS10BC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
NXP SEMICONDUCTORS
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
NO
32 MACROCELLS
In-System Programmable
NO
JESD-30 Code
S-PQCC-J44
S-PQFP-G44
JESD-609 Code
e0
JTAG BST
NO
Moisture Sensitivity Level
3
Number of Macro Cells
32
Number of Terminals
44
44
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
TQFP
Package Equivalence Code
LDCC44,.7SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK, THIN PROFILE
Peak Reflow Temperature (Cel)
225
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
12.5 ns
12.5 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
3
3
Clock Frequency-Max
59 MHz
Length
10 mm
Number of Dedicated Inputs
2
Number of I/O Lines
32
Organization
2 DEDICATED INPUTS, 32 I/O
Output Function
MACROCELL
Seated Height-Max
1.2 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Width
10 mm
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