PYA28HC256-90CWMB
vs
X28VC256PMB-90
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
XICOR INC
|
Part Package Code |
DIP
|
|
Package Description |
0.600 INCH, CERAMIC, DIP-28
|
PLASTIC, DIP-28
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.32.00.51
|
|
Access Time-Max |
90 ns
|
90 ns
|
JESD-30 Code |
R-CDIP-T28
|
R-PDIP-T28
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
32KX8
|
32KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
5 V
|
5 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
5.89 mm
|
4.82 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
Write Cycle Time-Max (tWC) |
10 ms
|
|
Base Number Matches |
2
|
1
|
Additional Feature |
|
PAGE WRITE
|
Length |
|
36.45 mm
|
|
|
|
Compare PYA28HC256-90CWMB with alternatives
Compare X28VC256PMB-90 with alternatives