PY264-55WM
vs
PY264-55WMB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
Access Time-Max
55 ns
55 ns
JESD-30 Code
R-CDIP-T24
R-CDIP-T24
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.715 mm
5.715 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
15.24 mm
15.24 mm
Base Number Matches
4
2
Compare PY264-55WM with alternatives
Compare PY264-55WMB with alternatives