PUMH9,115
vs
PUMH9
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
PLASTIC, SC-88, 6 PIN
Pin Count
6
Manufacturer Package Code
SOT363
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Additional Feature
BUILT-IN BIAS RESISTOR RATIO IS 4.7
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
50 V
Configuration
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
100
100
JESD-30 Code
R-PDSO-G6
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
Number of Elements
2
2
Number of Terminals
6
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.2 W
0.2 W
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
MATTE TIN
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Transistor Element Material
SILICON
Base Number Matches
2
3
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