PUMH2,115 vs MUN5213DW1T1 feature comparison

PUMH2,115 NXP Semiconductors

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MUN5213DW1T1 Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code TSSOP SC-88
Package Description PLASTIC, SC-88, 6 PIN CASE 419B-02, SC-88, 6 PIN
Pin Count 6 6
Manufacturer Package Code SOT363 CASE 419B-02
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.21.00.95
Factory Lead Time 4 Weeks
Additional Feature BUILT-IN BIAS RESISTOR RATIO 1 BUILT IN BIAS RESISTOR RATIO IS 1
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 50 V 50 V
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE) 80 80
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e0
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of Elements 2 2
Number of Terminals 6 6
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 240
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.2 W
Qualification Status Not Qualified COMMERCIAL
Surface Mount YES YES
Terminal Finish TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 6
Pbfree Code No

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