PUMH2,115
vs
MUN5213DW1T1
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
TSSOP
SC-88
Package Description
PLASTIC, SC-88, 6 PIN
CASE 419B-02, SC-88, 6 PIN
Pin Count
6
6
Manufacturer Package Code
SOT363
CASE 419B-02
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.21.00.95
Factory Lead Time
4 Weeks
Additional Feature
BUILT-IN BIAS RESISTOR RATIO 1
BUILT IN BIAS RESISTOR RATIO IS 1
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
50 V
50 V
Configuration
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
80
80
JESD-30 Code
R-PDSO-G6
R-PDSO-G6
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
NOT SPECIFIED
Number of Elements
2
2
Number of Terminals
6
6
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
240
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.2 W
Qualification Status
Not Qualified
COMMERCIAL
Surface Mount
YES
YES
Terminal Finish
TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
6
Pbfree Code
No
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