PUMD3,165 vs PUMD30 feature comparison

PUMD3,165 Nexperia

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PUMD30 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code TSSOP SC-88
Package Description SMALL OUTLINE, R-PDSO-G6 PLASTIC, SMD, SC-88, 6 PIN
Pin Count 6 6
Manufacturer Package Code SOT363
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Date Of Intro 1997-07-11
Samacsys Manufacturer Nexperia
Additional Feature BUILT IN BIAS RESISTANCE RATIO IS 1
Collector Current-Max (IC) 0.1 A
Collector-Emitter Voltage-Max 50 V 50 V
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE) 30 30
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 2 2
Number of Terminals 6 6
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN AND PNP NPN AND PNP
Reference Standard AEC-Q101; IEC-60134
Surface Mount YES YES
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 230 MHz
Base Number Matches 2 3
Pbfree Code Yes
Rohs Code Yes
Operating Temperature-Max 150 °C
Power Dissipation-Max (Abs) 0.3 W
Qualification Status Not Qualified

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