PUMD3,135
vs
PUMD3T/R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP
SC-88
Pin Count
6
6
Manufacturer Package Code
SOT363
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Collector Current-Max (IC)
0.1 A
0.1 A
DC Current Gain-Min (hFE)
30
30
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
Number of Elements
2
2
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Polarity/Channel Type
NPN AND PNP
NPN AND PNP
Power Dissipation-Max (Abs)
0.3 W
Surface Mount
YES
YES
Terminal Finish
TIN
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
2
Pbfree Code
Package Description
SMALL OUTLINE, R-PDSO-G6
Additional Feature
BUILT-IN BIAS RESISTOR RATIO IS 1
Collector-Emitter Voltage-Max
50 V
Configuration
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
JESD-30 Code
R-PDSO-G6
Number of Terminals
6
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Qualification Status
Not Qualified
Terminal Form
GULL WING
Terminal Position
DUAL
Transistor Application
SWITCHING
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